E-waste precious metal refining and extraction method

Many wastes contain precious metals gold, silver, platinum, and palladium, but the content varies. Common ones with higher grades of precious metals, and those with extraction value are: waste electronic circuit boards. Such as waste computer boards, telecommunications boards, VCD boards, TV boards, etc.

All kinds of gold-plated parts, such as aviation plugs, gold-plated plug-ins on various electrical appliances, gold-plated electronic components, electronic feet, gold-plated handicrafts, etc. All kinds of electroplating wastewater and mud containing precious metals.

Waste circuit boards are disassembled into tin slag, metal components, electrolytic capacitors, integrated circuit chips, chip capacitors, plastic packaging, CPU and RAM, and motherboards by automatic dismantling machines. Tin slag and metal components can be sold directly, and electrolytic capacitors are separated into aluminum powder and plastic powder through capacitor recycling equipment, which is also very useful. Heavy metals such as platinum, palladium, gold, silver and copper can be extracted from integrated circuit chips and chip capacitors through carbonization furnaces and precious metal sorting and refining equipment. The recycling value of waste circuit boards is very large.

The precious metal sorting and refining production line is used to sort and refine precious metals such as gold, silver, palladium and platinum from electronic waste containing precious metal chip components and anode slime. The collective material with the highest amount of gold and silver in the element conforms to the unified treatment element, and can be used for baking with ozone (ozone can completely destroy the harmful flue gas formed by combustion). Platinum palladium, extracted gold, platinum, palladium. For chip capacitors with high silver and palladium content, silver and palladium are independently extracted by acid method.

For silver- and palladium-containing acoustic surfaces, metal-encapsulated triodes, and integrated circuits, use a special cutting machine to cut off the metal shell and punch out the chip, and then extract valuable metals according to the chip and integrated circuit scheme. After crushing, metal aluminum is directly smelted. For Zener diodes, some varactor diodes, other glass-sealed components, and plastic-sealed luminous tubes, valuable metals are extracted after being crushed. Electrolytic copper is produced, palladium-containing circuit boards (double-sided circuit boards basically contain palladium, and palladium is used as a copper-plated substrate and contained in the conducting holes used as wires), and then palladium is leached with acid, and then palladium is extracted and extracted.